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dc.contributor.advisorFeinerman, Alanen_US
dc.contributor.authorDankovic, Tatjanaen_US
dc.date.accessioned2013-06-28T17:45:55Z
dc.date.available2013-06-28T17:45:55Z
dc.date.created2013-05en_US
dc.date.issued2013-06-28
dc.date.submitted2013-05en_US
dc.identifier.urihttp://hdl.handle.net/10027/9983
dc.description.abstractA new technique has been developed to make valves and other microfluidic structures by patterned welding of compliant thermoplastic films. Electrical contacts, packaging, and low leakage connections with external tubing to these structures have also been demonstrated. An electrostatically driven normally open microvalve made of thermoplastic materials is presented. The microvalves are compatible with a wide range of fluids. The microvalve is limited to actuation voltages less than 600 V because of the breakdown voltage limitation of 1.4 µm thick Mylar film. The pressure range is limited by the value of the closing voltages to few kPa, although the valve can withstand much higher applied pressures (~20 kPa). The operating temperature should be limited to 100 ºC because of the low melting point of the LLDPE tubing and support rings. The measured leak rate for well manufactured microvalves was less than 10% of the flow rate. The proposed fabrication method for welding very thin polyester sheets is used to produce several types of micromixers and demonstrate its potential use for producing different designs of mixer structures that can be modified as needed without the need for a photolithography or microfabrication facilities. The proposed fabrication technique is applicable for the design of the planar microfluidic devices.en_US
dc.language.isoenen_US
dc.rightsen_US
dc.rightsCopyright 2013 Tatjana Dankovicen_US
dc.subjectmicrovalveen_US
dc.subjectelectrostatic microvalveen_US
dc.subjectmicroweldingen_US
dc.subjectmicromixeren_US
dc.subjectthermoplasticen_US
dc.subjectthermoplastic microvalveen_US
dc.titleDesign, Simulation and Characterization of Compliant Microfluidic Devicesen_US
thesis.degree.departmentElectrical and Computing Engineeringen_US
thesis.degree.disciplineElectrical and Computer Engineeringen_US
thesis.degree.grantorUniversity of Illinois at Chicagoen_US
thesis.degree.levelDoctoralen_US
thesis.degree.namePhD, Doctor of Philosophyen_US
dc.type.genrethesisen_US
dc.contributor.committeeMemberDutta, Mitraen_US
dc.contributor.committeeMemberGhosh, Siddharthaen_US
dc.contributor.committeeMemberMegaridis, Constantineen_US
dc.contributor.committeeMemberBusta, Heinzen_US
dc.type.materialtexten_US


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